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Ảnh sản phẩm thuộc về PNLAB

Thông tin chi tiết sản phẩm

Tên sản phẩm:

thiếc hàn kem 500g

Giá:

430.000

Tình trạng:

liên hệ

Xuất xứ:

China

Hãng sản xuất:

JF

Mã sản phẩm:

PN_JF500P

430.000

430.000 1+ units
400.000 10+ units
380.000 100+ units
Product Name:Sn63Pb37
Description:
Tin-lead solder paste:
This series solder paste is made ​​of powdered solder and flux uniformly mixed into a high-viscosity products. Their own modest convergence, printing, injection spit, etc., after printing, the adhesion can be maintained for a long time , so that the floating substrate stickers engineering work is easy. Its unique way of solder powder is made ​​based on the non-oxidation atomized powder, so the use of the phenomenon does not occur when the solder ball and solder point of light. By oxidation was minimal lead-free alloy with no activity better help paste the preparation, printing and point to meet the viscosity coating process, a very wide range of applications.
★ adapt to a variety of electronic circuit board mounted associated industries a variety of different processes have lead solder.
★ adapt to various components of lead or solder dip tin.
★ but also for a variety of special welding process.
★ also can according to the customer's actual production to meet customer production deployment of leaded solder paste.
The advantage of leaded solder paste
★ uses its proprietary flux paste formulations little residue, and the pale color.
★ continuous printing is very little viscosity change with time, to obtain a stable printing results.
★ choose a variety of Packing: gauge copper style and canned.
★ The 0.4-0.6mm and above spacing of the circuit, to be completed by the fine print.
 
 
Specifications:
Alloy: Sn63Pb37
Powder Specifications: 3 powder
Melting point: 183 ° C.
Stream support system: fine pitch, high-speed printing.
Packing: 500g / bottle: 50g / bottle
Parametric analysis:
 
AT-888C
AJ-888B
Alloycomposition
Sn63/Pb37
SN63/Pb37
(Sn62/Pb36/Ag2)
Actiwity
RMA
RA
Melting point
183℃
183℃/179℃
Fluxpercentage
9.5±0.5%
9.5±0.5%
Powder size
20~45μm
20~45μm
Viscosity(X10 4 CP)
18.0±3.0
17.5±3.0
Halide content
<0.1%
<0.16%
Copper plate corrosion
Pass
Pass
S.I.R.
>1.0*10 12Ω
>1.0*10 12 Ω
Solderspreadability
≥92.3%
≥94.2%
Shelf-life
6months
6months
Tack-time
>12hour
>12hour
Storagetemperature
0~10 ℃
0~10 ℃
Solder alloy used
 
Melting point
Element
Remark
Alloy ratio
Fahrenheit
Celsius
Major elements
* Other alloys specially produced on demand.
* The number next to its alloy weight.
Sn63Pb37
361
183
Sn、Pb
Sn62Pb36Ag2
354~372
179~189
Sn、Pb、Ag
Sn96.5Ag3.5
430
221
Sn、Ag
Sn43Pb43Bi14
291~325
144~163
Sn、Pb、Bi
Tin powder particle size distribution
Model
Mesh code
Diameter (UM)
Suitable spacing
T2
- 200/+325
45~75
 ≥ 0.65mm(25mil)
T2.5
- 230/+500
25~63
 ≥ 0.65mm(25mil)
T3
- 325/+500
25~45
 ≥ 0.5mm(20mil)
T4
- 400/+500
25~38
 ≥ 0.4mm(16mil)
T5
- 400/+635
20~38
 ≤ 0.4mm(16mil)
T6
N．A．
10~30
 Micro BGA
 
Note:
After reflow, the residue without cleaning, for cleaning, using conventional cleaning agents can be.
Printing gap more than one hour, you should paste back into the bottle and cap tightly.
Remove the paste from the refrigerator, the subject about 2 hours before opening the lid of the natural thawing before and after use with a small blade stirring for 2-3 minutes.
 
Storage:
2-10 degrees refrigerator storage period of 6 months.